白光干涉輪廓儀 干涉儀產(chǎn)品主要特點:
MicroXAM白光干涉輪廓儀干涉儀納米輪廓儀，微納米加工測量，蘋果（apple)輪廓儀
OVERVIEW
The MicroXAM-100 complements our surface profiling portfolio with a research grade, non-contact optical profiler. The MicroXAM-100 is a full-featured white light and
phase-shifting interferometer that brings a powerful set of features and capabilities to the general research community. The system provides precise high-resolution, non-contact 3D profiles on both smooth and rough surfaces. The intuitive user interface allows for a fast learning curve ensuring quick and productive use of the tool in any environment.
The MicroXAM-100 can measure fields of view from 100 X 100 microns to
1.0mm x 1.0mm (dependent on the objective lens used). The MicroXAM-100 optical interferometer quickly and accurately measures the 3D topography of surfaces at the nanometer level with a z-scan range of 250 microns (or up to 10 mm with Z-stitching). Multiple images can be stitched together to produce extended fields of view.
- PSI (phase) and VSI mode (vertical) with patented noise suppression technology
- 100 µm closed loop piezo stage and 10mm z-stage for VSI scanning mode
- Sample stages up to 8” (200mm) with full stage travel
- X-Y stage options supporting manual, motorized, and programmable 4, 6, and 8” (100, 150, and 200mm)
- Sequence, Stitching, Thick film thickness, dissimilar materials, and masking measurement modules.
-
The MicroXAM-1200 3D non-contact profilometer is a surface characterization solution for a wide range of applications and industries - from R&D departments, universities, and commercial labs to production monitoring and process control in IC manufacturing and data storage. The non-contact profilometer uses white light interferometry to generate high-resolution 3D images that provide the industry’s highest vertical resolution with excellent repeatability and precision, and superior reliability measurements. This surface analysis solution delivers automated data collection, automated analysis and reporting, with 2D or 3D advanced analysis suite to address a variety of application and reporting needs.
- PSI (phase) and VSI mode (vertical) with patented noise suppression technology
- 100 µm closed loop piezo stage and 10mm z-stage for VSI scanning mode
- Sample stages up to 8” (200mm) with full stage travel
- X-Y stage options supporting manual, motorized, and programmable 4, 6, and 8” (100, 150, and 200mm)
- Sequence, Stitching, Thick film thickness, dissimilar materials, and masking measurement modules.
MicroXAM白光干涉輪廓儀干涉儀
The precision engineered hardware along with powerful yet simple to use MapVUE® AE analysis software package offers the user a number of parameter calculations, filtering options, imaging analysis and automated report generation to meet the most stringent R&D and production environment needs. MapVUE AE’s user interface offers simple recipe development, automated sequencing, and with a range of analysis tools. The flexibility of the instrument is further demonstrated with its mix of objectives and sample stages available to meet the need of each application with customization.
APPLICATIONS
Medical Devices
MicroXAM白光干涉輪廓儀干涉儀
Surface texture, defect inspection, wear volume measurement and film thickness measurement of medical implants such as heart-valves, artificial joints, dental implants and stents.
Precision Machining
Wear on cylindrical surface, grain structure analysis, surface roughness characterization and form measurement
Data Storage
LED
Sapphire substrate roughness, waviness and edge roll-off; patterned sapphire bump height and width; defect characterization, and step height for photo resist and metallization
Semiconductors and Electronics
Wafer inspection including height of through silicon via and bond pads, height of deposition and etch steps film thickness, critical dimension measurement
Optics
Surface pattern and feature dimensions of holographic elements, micro-lens arrays, gem surface facet surface analysis and critical dimensioning, fiber optics connector end-face, etch performance and mask quality.
Shape, surface detail and defect features of MEMS sensors, actuators, deformable optics and pumps. Non contact process allows in situ measurement of activated structures.
MicroXAM白光干涉輪廓儀干涉儀
MicroXAM白光干涉輪廓儀干涉儀
